摘要 |
PURPOSE:A curable resin material having a long pot life and easily forming a cured product having a small number of bubbles in the inside, prepared by mixing a photocurable synthetic resin material with a cold or hot curing agent and further adding to the mixture a fine inorganic filler powder. CONSTITUTION:A curable resin material prepared by mixing a photocurable synthetic resin material (e.g., epoxy acrylate or unsaturated polyester resin) with a cold curing agent (e.g., a polyamide for epoxy resins and benzoyl peroxide for unsaturated polyester resins) and/or a hot curing agent (e.g., lauroyl peroxide or cumene hydroperoxide) and a fine inorganic filler powder (e.g., SiO2 or CaCO3). The presence of this powder prevents the resin material from undergoing anaerobic curing. Therefore, it shows a long pot life and can be fully vacuum-defoamed and therefore it can easily form a cured product having a small number of bubbles in the inside and is useful as, for example, a sealant for electronic parts such as composite blocks or integrated circuits.
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