| 摘要 |
PURPOSE:The titled material excellent in heat radiation characteristics, etc., and capable of easily forming a thick colored cured product which is substantially free of uncured parts, prepared by mixing a light- or electron beam-curable synthestic resin material with both a cold curing agent and an inorganic filler. CONSTITUTION:A curable resin material prepared by mixing a light- and/or electron beam-curable synthetic resin material (e.g., epoxy acrylate or unsaturated polyester resin) with both a cold curing agent (e.g., a polyamide for epoxy resins, and benzoyl peroxide for unsaturated polyester resins) and an inorganic filler (e.g., hydrated alumina or silica). This resin material is excellent in physical properties such as heat radiation and can easily form a thick colored cured product which is substantially free of uncured parts, and therefore the material is useful as, for example, a sealant for electronic parts such as composite blocks or integrated circuits.
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