发明名称 COPPER FOIL FOR A PRINTED CIRCUIT
摘要 Copper for a print circuit has a nickel layer with a phosphorus or a copper layer. Metals having layers of thin copper, nickel, tin cobalt and Cu-Zn alloy cannot be easily etched by the hyper-sulfuric ammonium solution that is typically used. To solve this problem, thin copper for a print circuit has a nickel layer containing formed phosphorous on the attached copper layer. The manufactureing method uses plating through a nickel plate bath, then the metal is washed and dried.
申请公布号 KR840001643(B1) 申请公布日期 1984.10.12
申请号 KR19810001120 申请日期 1981.04.03
申请人 HURUKAWA SUKIT HOIL CO.,LTD. 发明人 NAKATCHKAWA HIROSI
分类号 H05K3/38;(IPC1-7):H05K3/38 主分类号 H05K3/38
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