发明名称 SOLDERING DEVICE
摘要 PURPOSE:To provide a titled device which performs automatically partial soldering and improves working efficiency by ejecting a part of the molten solder turning in a solder tank through ejecting holes to the upper part so that the solder is stuck only on the soldering parts of a circuit board covered with the unnecessary parts. CONSTITUTION:The molten solder in a solder tank 2 is fluidized by an agitator at the tip of a propeller shaft 3 and the fluid pressure thereof is energized by the slit-like ejecting holes of box-shaped limiting devices 1, 21 for ejecting areas to eject the solder to the upper part. As a plate 18 for holding a circuit board is turned, the ejecting solder is stuck only on the parts of a circuit board 17 where soldering is required, threby soldering said parts. The parts or circuit board surface where soldering is not required is covered and protected by the covering members 15, 24 of the plate 18. The partial soldering of the circuit board is peviously difficult to be automated and is accomplished by a manual operation but the automation is made possible by the above-mentioned device and the working efficiency is considerably improved.
申请公布号 JPS59179266(A) 申请公布日期 1984.10.11
申请号 JP19830055780 申请日期 1983.03.31
申请人 DAIKI KOGYO KK 发明人 HISAMATSU RIICHI;MATSUMOTO KENZOU
分类号 H05K3/34;B23K1/08;B23K3/06 主分类号 H05K3/34
代理机构 代理人
主权项
地址