发明名称 HOT-MELT ADHESIVE COMPOSITION
摘要 Hot-melt adhesives with good adhesion contain 20-100:80-0 blends of hydrolyzed (250%) 50-95:50-5 ethylene-vinyl acetate polymers (I) and/or their unsatd. aci-grafted derivs. with compatible resins, tackifiers, and optionally waxes. Thus, a blend of sapond. (90%) 72:28 I (Dumilan D-219, melt index 170 g/10 min) 35, C5 petroleum resin (Quinton 1500, softening point 100oC, acid no. ( 1, sapon no. 155-175, Br no. 55-70) 35, and paraffin wax (m.p. 66oC) 30 parts shows no phase sepn. at 20 or 160oC and forms a compatible molded sheet.
申请公布号 KR840001600(B1) 申请公布日期 1984.10.11
申请号 KR19810000651 申请日期 1981.02.27
申请人 TAKEDA CHEM IND CO.,LTD. 发明人 NAKABAYASHI MASAMITSU;DOURA FUMIHIRO;TATSUMI TETSUJIRO;MIYAMOTO REIJI
分类号 C08L23/06;(IPC1-7):C09J3/14 主分类号 C08L23/06
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