Bondable and solderable thin-film conductor tracks with plated-through holes

摘要

Partially bondable and solderable thin-film conductor tracks which are deposited as a multilayer conductor track on a substrate are produced by vapour deposition or sputter deposition of NiCrCuAl. According to the invention, plated-through holes and bonding sites are produced after removing the protective layer by exposing a readily electroplatable surface and then electroplating with Au or NiAu. <IMAGE>