| 摘要 |
PURPOSE:To unnecessitate bumps to be provided on the titled chip and thus simplify bonding processing by a method wherein the surface of said chip having pads is covered with resist, parts corresponding to the pads are removed, and the generated holes are filled with conductive substance, thereafter the chip is directly bonded to the pad on a substrate, and next the entire body is sealed with resin. CONSTITUTION:When the semiconductor chip 2 having pads is mounted on the substrate 1 provided with a conductor pattern, the side of the chip 2 opposed to the substrate 1 is coated with the resist 6. Next, holes 10 are bored in the resist 6 by corresponding to the pads provided on the chip 2, which holes are filled with the conductive substance 8. Thereafter, the pads are connected to said substance 8 by direct bonding, and the chip 2 on the substrate 1 is sealed with the resin 4. Thus, bumps are unnecessitated to the chip, and therefore the mounting of the element becomes extremely simple. |
