| 摘要 |
PURPOSE:To contrive the improvement of releasing performance of a die and the rate of operation, by applying a layer of Ti compound to the surface forming a cavity. CONSTITUTION:A layer of Ti compound, for example, of TiN and TiC is formed on the surface forming a cavity 2 of a metal die 1 by vacuum evaporation. Although thickness of the layer 3 of the Ti compound is 1-20mum, the thickness of 2-5mum is desirous in consideration of both sides cost and performance. With this constitution, opening of the die and taking out of a product can be done easily without applying a mold releasing agent to the die and the rate of operation is improved. |
