发明名称 |
SEMICONDUCTOR ELEMENT |
摘要 |
In potted (encapsulated) semiconductor components having an aluminium base (1), bubbles may appear during potting. These are due to a chemical reaction between the aluminium and substances contained in the potting material (10). The bubble formation can be prevented if the aluminium base (1) is provided with a protective layer (9) in those places where it is covered by the potting material (10). <IMAGE> |
申请公布号 |
JPS59178753(A) |
申请公布日期 |
1984.10.11 |
申请号 |
JP19840052057 |
申请日期 |
1984.03.16 |
申请人 |
SIEMENS SCHUCKERTWERKE AG |
发明人 |
PEETAA HAIDEGAA;HERUBERUTO KAPUTSUA |
分类号 |
H01L23/28;H01L23/049;H01L23/24;H01L23/31 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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