发明名称 ARRANGEMENT OF DIODES INTEGRATED ON AN INSULATING SUBSTRATE
摘要 A semiconductor device comprises an insulating layer (10), a first p-type region (12-1) and a first n-type region (12-2) formed on the insulating layer to constitute a first diode, and a second p-type region (12-4) and a second n- type region (12-3) to constitute a second diode. The first p-type region (12-1) abuts on the second n-type region (12-3) and is isolated from the second p-type region (12-4), while the first n-type region (12-2) abuts on the second p-type region (12-4) and is isolated from the second n-type region (12-3). The isolation may be a gap 14 in the semiconductor layer or a solid portion of insulation material. Electrodes 18, 20 short these pin junctions in an array of such devices which are not required. <IMAGE>
申请公布号 GB2069756(B) 申请公布日期 1984.10.10
申请号 GB19810002334 申请日期 1981.01.26
申请人 TOKYO SHIBAURA DENKI KK 发明人
分类号 H01L29/861;H01L21/762;H01L21/764;H01L23/522;H01L27/12;(IPC1-7):01L27/12;01L29/06 主分类号 H01L29/861
代理机构 代理人
主权项
地址