| 摘要 |
PURPOSE:To enable to perform efficiently electron beam exposure by a method wherein the position of the central chip of a wafer is detected accurately, and effective chips are calculated previously according to positional informations thereof. CONSTITUTION:When exposure of a wafer is to be performed, rotating detection is performed to adjust the chip printing direction, the electron beam scanning direction and the stage transferring direction. When rotating detection thereof is performed, by detecting the mark of a central chip provided on the wafer, the positional coordinates (Ox, Oy), namely slipage from the center of the wafer can be obtained accurately. The fact that it is an effective chip or not is judged in regard to respective chips using the coordinates thereof. Then, by performing electron beam exposure only to the chips judged as the effective chips, ineffectual chip exposure can be checked. It is desirable to separate previously the respectively chips into three ranks R1-R3. |
