| 摘要 |
PURPOSE:To absorb and eliminate any difference in elongation produced in case and between sealing resin and terminal by the heating due to operation of a semiconductor by means of a terminal provided with elastic shape in a resin case by sealing resin is formed into zigzag shape with notches formed by curving into both side edges. CONSTITUTION:A terminal 11 is provided with notches 11a, 11a', 11a'' formed by curving into both side edges of silicon resin immersed part making this part of the terminal 11 zigzag. Through these processes, the terminal heating may be restricted to conventional heating by means of adapting the sectional area of this zigzag part to passing current while the terminal structure may be provided with sufficient elasticity in all directions. Besides in other structure, an end 21a on the solder side is provided with a part 21a' out of the extention of the width of terminal main body. On the other hand, the end 21a is provided with other notches 21b, 21b', 21b'' formed by curving into both side edges of the part immersed in silicon resin near the end 21a making the notches 21b, 21b', 21b'' zigzag with S shape of specified width. |
