| 摘要 |
PURPOSE:To disperse stress applied to a bed on which a semiconductor pellet is mounted, to prevent the cracking of a resin sealing body, etc. and to improve the characteristics of an element by forming grooves for absorbing stress to the corner sections of the lower surface of the bed. CONSTITUTION:Grooves 15 for absorbing stress function as the dispersion and absorption of stress generated with the expansion and contraction of a resin sealing body 16, etc. when the change of heat is applied to a semiconductor device integrally sealed by the resin sealing body 16 by a reliability test, etc. Consequently, the positions of the formation of the grooves 15 shall be the corner sections of the back of a bed 10 where stress is easy to concentrate. The size, number and shape of the grooves are set in consideration of the size of a semiconductor pellet 11 and the bed 10, the quality of material of the resin sealing body 16, etc. The grooves 15 are formed in such a manner that a resist film of a predetermined pattern is shaped on a sheet for forming a frame, a section as the bed 10 is specified, a resist film for forming the grooves is shaped on the back side of the section as the bed, and the back is etched and treated while using these resist films as masks. |
