| 摘要 |
PURPOSE:To provide a thermally conductive material having excellent insulating properties and thermal conductivity and suitable for use as a heat dissipation material for electronic parts, by blending specified additives with a matrix consisting of an ethylene/vinyl acetate copolymer and a thermoplastic elastomer. CONSTITUTION:20-50wt% matrix (A) obtd. by mixing an ethylene/vinyl acetate copolymer having a vinyl acetate content of 45wt% or below with a thermoplastic elastomer such as polyisobutylene in a ratio of 1:1-4, 50-80wt% filler (B) such as aluminum oxide or aluminum hydroxide, a crosslinking agent (C) such as dicumyl peroxide, 0-1wt% antioxidant (D) such as tetrakis[methylene-3-(3', 5'-t-butyl-4'-hydroxyphenyl)propionate]methane and 5-15wt% reinforcing material (E) such as chopped glass fiber are kneaded together by using a pressure kneader. The mixture is molded to obtain a thermally conductive material.
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