| 摘要 |
In the case of the fabrication of semiconductor devices, lead frames are successively transferred to the bonding position where semiconductor chips are bonded to a lead frame. To this end, a lead frame transfer device has been used. According to the present invention, there are provided means for adjusting the distance between a pair of guide rails which define the lead frame transfer passage and means for varying the transfer stroke or pitch of a device for transferring a lead frame along the guide rails. The means for adjusting the distance between the pair of guide rails comprises gage holes and gages or lead screws and nut so that one of the pair of guide rails is moved toward or away from the other guide rail depending upon the width of a lead frame to be transferred. The means for varying the transfer stroke or pitch of a device for transferring a lead frame comprises cams and sensors, and varies them through rotating a screw shaft combined with a nut by a motor. |
