| 摘要 |
<p>PURPOSE:To increase the adhesive strength of ink, and to prevent the disappearance of marks for displaying quality by forming a smooth surface and a crape surface to the outer surface of a resin and shaping these marks on the smooth surface when the marks are put on the resin seal surface of a semiconductor element by a laser-marking method or a bar code. CONSTITUTION:When a large number of leads 3 for external connection are sealed by using a resin 1 while being projected to the outside, a die for a resin seal, sections thereof corresponding to the upper surface and side end surfaces of the resin 1 are formed to a crape shape through electrical discharge machining and a lower surface thereof is formed to a specular shape through grinding machining, is used. Printed marks 2 are formed on the crape surface of the upper surface obtained by the die, and bar codes 5 are marked to the specular surface 4 of the lower surface through a laser-marking method. Accordingly, beams perform irregular reflection only at the code sections 5 when beams are irradiated to the specular surface 4, and informations are read positively. That is, a process in which the specular surface is generated at the same time as the resin sealing and the process for forming specular surface again is omitted.</p> |
