| 摘要 |
PURPOSE:To prevent the contamination of semiconductor wafer and the like with impurities by a method wherein two supporting rods to be used for supporting the bottom face of the housing jig for semiconductor wafer are provided in a semiconductor wafer processing vessel at the position 1cm or more higher than the bottom face of the processing vessel. CONSTITUTION:Supporting rods 6 and 7, to be used to support the bottom face of the housing jig 3 wherein a semiconductor wafer 5 will be housed, is provided on the side wall 1 of a processing vessel. Said supporting rods 6 and 7 are provided 1cm or more higher than the bottom face 2 of the processing vessel. As a result, the impurities such as a reactive product, other non-dissolving substances and the like which are deposited on the bottom face of the processing vessel do not come in contact with or adhered to the jig 3 and the wafer 5. |
