| 摘要 |
PURPOSE:To contrive the upgrade of mounting density and the reduction of the number of external lead by a method wherein a semiconductor chip element placing part and a passive circuit element placing part are juxtaposed on a chip carrier base and the prescribed element is put on each placing part and is individually sealed. CONSTITUTION:A semiconductor memory chip 2 and capacitors 3 are provided on a chip carrier base 1 and the memory chip 2 is connected with wires 4. The bottom surface of the base 1 is composed of die attachements 5 adhered with the tip 2 and pads 6 to be used for mounting the capacitors on. Connection material such as Ag paste, low melting point-glass containing conductive powders, Au-Ge, etc., are placed on the pads 6. The electrode parts of the titanic acid barium-system chip capacitors 3 are put thereon to the connection material and while these are being heated, the chip capacitors 3 are adhered on the pads 6. The memory chip 2 is also adhered similarly on the attachments 5. Then, a ceramic chip carrier package is sealed. |
