MEJORAS EN SEMICONDUCTOR DE CONTACTO AXIAL PARAPOSTE NO-PLANAR Y PROCEDIMIENTO PARA OBTENERLO

摘要

Axial lead semiconductor device package (30) for use with non-planar semiconductor die (23). By using solders of predetermined strength, wetting and flow characteristics, melting temperature, shape, area, and thickness, reliable attachment of non-planar die (23) to planar mounting surfaces (36) is achieved.