| 摘要 |
PURPOSE:To suppress heating of an electronic part chip and to enable to make the high-density chip, by opening a through-hole through a printed circuit board at a position where there exists a metal plate, by filling a metal member with high heat-conductive resin in between in the through-hole, and by mounting the electronic part chip on the surface of the printed circuit board at a position where there exists the metal member. CONSTITUTION:A substrate 3 is comprised of insulator 1 and a metal plate 2 substituted for a portion of the insulator 1, and a conductor layer 4 is formed at least on one face of the substrate 3 to constitute a printed circuit board 5. At a position where there exists a metal plate 2, a through-hole is opened through the printed circuit board 5. In this through-hole, a metal member 17 is filled with high heat-conductive resin 16 in between, and at a position where there exists the metal member 17, an electronic part chip 6 is mounted on the surface of the printed circuit board 5. Thus better heat radiation can be attained so that the electronic part chip 6 does not have a high temperature. |
