发明名称 MANUFACTURE OF POLYCRYSTALLINE SILICON WAFER
摘要 PURPOSE:To strip off easily a product wafer by using a manufacturing dish provided with a coated layer of a mold releasing agent on its top surface when a polycrystalline wafer is produced by a spin method. CONSTITUTION:At the central part of a rotating dish 1 for manufacturing, molten silicon is dropped, and a thin film of molten liquid formed on said dish 1 is cooled and solidified to form a polycrystalline silicon wafer 3' (spin method). In above-described method, on the flat surface 1a of the dish for forming a wafer, the coated layer 2 of a mold releasing agent having a several thousands Angstrom thickness and consisting of silicon oxide, silicon nitride or the like is formed by means of vacuum deposition, CVD method, etc. for using it as the manufacturing dish.
申请公布号 JPS59174514(A) 申请公布日期 1984.10.03
申请号 JP19830047725 申请日期 1983.03.22
申请人 HOKUSAN:KK 发明人 YOKOYAMA TAKASHI
分类号 C01B33/02;H01L31/00;H01L31/04;H04B7/005 主分类号 C01B33/02
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