| 摘要 |
PURPOSE:To omit a connecting wiring pattern and a bump by a method wherein a recess is formed in a printed wiring substrate, an electronic component is contained and fixed therein, and another one is face-down-bonded to the bonding lead terminal of said component. CONSTITUTION:The connecting wiring pattern 2' to connect one electronic component 4 to another circuit element 5, etc. is provided on the substrate 1. The recess 6 is to contain the electronic component 5. The depth of the recess 6 is prescribed so that the top of the contained component 5 and said pattern 2' are in approximately the same plane. Said component 5 contained in this recess 6 is fixed by means of adhesive with the bonding lead terminal upside, and the other electronic component formed by connecting one bump to said pattern 2' is directly bonded to the lead terminal via bump 3. Thereby, the bump of said component 4 is directly bonded to the lead terminal of said component 5. |
