发明名称 REFLOW FURNACE
摘要 PURPOSE:To solder a work placed with parts on a base plate with excellent operability without damaging the parts on account of overheating in the stage of soldering said work by heating, soldering and cooling the work while conveying the same with a rotary table. CONSTITUTION:A rotary table 20 attached with plural work brackets 30 and a water tank 50 for cooling are attached on a base plate 10. A heater 40 and a cooling fan 70 are installed above the same. A work to be soldered is loaded on the bracket 30 in a position A, then the table 20 is rotated to move the work to a point C, where the tank 50 is risen and while the work is cooled from below, the top surface thereof is heated by a preheater 41 using IR rays and a main heater 42 to melt the solder and to solder the parts to the base plate. The soldered part is further cooled to solidify by the fan 70. The work is removed from the bracket 30 in the position B. The work is soldered with excellent operability without being damaged by overheating of the work.
申请公布号 JPS59174272(A) 申请公布日期 1984.10.02
申请号 JP19830049381 申请日期 1983.03.23
申请人 ROOMU KK 发明人 YASUMURA TOSHIHIKO
分类号 C23C2/02;B23K1/005;B23K1/008;F27D11/02;H05K3/34 主分类号 C23C2/02
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