发明名称 VAPOR DEPOSITION APPARATUS
摘要 PURPOSE:To enhance vapor deposition efficiency and heat efficiency, by preventing electron beams reflected from a metal material to be vapor deposited from discharging in all directions while constituting a passing orifice for supplying the metal material from water cooled copper. CONSTITUTION:A water cooled copper main body 12 having a recessed part for storing a metal material 10 to be vapor deposited provided to the upper part thereof is provided so that one side wall 13 thereof is inclined at the height receiving electron beams which are incident to the metal material 10 to be vapor deposited stored in said recessed part and reflected to a direction opposite to the incident direction thereof. Therefore, electron beams incident to the metal material 10 to be vapor deposited are not discharged in all directions. In addition, a orifice 15 for supplying the metal material 10 to be vapor deposited is provided to the bottom of the recessed part of the water cooled copper main body 12 for constituting the crucible 9 and the metal material 10 to be vapor deposited is pushed up from the passing orifice 15 to be supplied to the crucible 9. The orifice 15 is constituted of water cooled copper and continuous vapor deposition is smoothly performed.
申请公布号 JPS59173264(A) 申请公布日期 1984.10.01
申请号 JP19830046422 申请日期 1983.03.18
申请人 HITACHI MAXELL KK 发明人 OOTOMO YOSHIROU;WAKAI KUNIO;NIIMI HIDEAKI;OOIWA TSUNEMI;TOTSUTORI TAKESHI
分类号 C23C14/56;C23C14/30 主分类号 C23C14/56
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