发明名称 METHOD AND DEVICE FOR LASER MARKING
摘要 PURPOSE:To add a defective mark which is extremely easy to see by fitting a semicylindrical lens right in front of a laser emitting body. CONSTITUTION:The semicylindrical lens 1 is fitted right in front of the laser emitting body 2 and a semiconductor wafer 6 is mounted on the sample base 7 of a wafer prober; and a signal is sent from a tester to the electrode of a semiconductor device through the probe 5 of a probe card 4 to inspect electric characteristics of the semiconductor device, and if the result indicates defect, the defective semiconductor device 10 is irradiated with laser light 3 from the laser emitting body 2 through the semicylindrical lens 1 to display a thin and long mark as the defective mark 8. The surface of a defective semiconductor device 10 is melted on its surface conventionally by increasing the intensity of the laser in order to make the defective mark easy to see by the naked eye, but this defective mark 8 is thin and long, so the mark is seen even by the naked eye, thereby eliminating the need to increase the intensity of the laser.
申请公布号 JPS59172622(A) 申请公布日期 1984.09.29
申请号 JP19830048222 申请日期 1983.03.23
申请人 NIPPON DENKI KK 发明人 MATAI SADAO
分类号 B41M5/26;G02B27/00;G02B27/09;H01L21/66 主分类号 B41M5/26
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