| 摘要 |
PURPOSE:An epoxy resin composition for molding electronic devices and appliances excellent in cracking resistance and tracking resistance but yet inexpensive, prepared by replacing a silane-treated silica powder as a filler with silica powder and a silane coupling agent. CONSTITUTION:100pts.wt. cycloaliphatic epoxy resin (epoxy equivalent of about 150-170g/eq) is mixed with about 100pts.wt. hexahydrophthalic anhydride (curing agent), a cure accelerator, about 350pts.wt. silica powder (e.g., usual silica powder), and a small amount of a silane coupling agent. The kind and amount of the silane coupling agent used are appropriately selected according to the wettability between the silica powder and the resin at the interface.
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