| 摘要 |
PURPOSE:To contrive to miniaturize an apparatus and to increase performance by enabling to omit a power source part used for a small-sized electronic apparatus, etc. by mounting a semiconductor circuit element and a solar battery on the same package. CONSTITUTION:A semiconductor IC chip is previously installed to the part 1 of a package and then wire-bonded, and a cap is put over the part 1, thereafter a solar battery 5 is directly adhered on a lead frame 7. Then, the electrode of the solar battery 5 is bonded to the lead to be a power source by means of wires 10. After finishing wire bonding, said battery 5 is sealed by using a transparent cap 4 of an insulation material. The titled device equipped with said battery 5 is completed, and said device continues to operate semipermanently, as long as light exists. Further, if the efficiency of said battery 5 improves in the future, resulting in the increase of consumed power of the semiconductor circuit element, it is possible to supply the power of said battery 5 not only to a simultaneously mounted semicondutor circuit but to the other parts. |
