发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To simplify a heating step and to enable hardening with comparatively low illuminaion by using a photosensitive resin compsn. comprising a polyester acrylate monommer or oligomer, a polyvinylphenol deriv., a photopolymn. initiator, and a sensitizer. CONSTITUTION:A polyester acrylate monomer or oligomer used for the essential component of a photosensitive resin compsn. is as follows: CH2=CHCOO(CH2)5 OCOCH=CH2 or CH2=C(CH3)COOCH2CH(C2H5)C4H9, having 150-1,000mol.wt. As an alkali peeling promoting adjuvant, polyvinylphenol deriv. having 5,000- 11,000, is used, and it has, for example, repeating units represented by formula I in which R1 is one of H, CH3, and C2H5. Any polymn. initiator, initiating photopolymn. reaction with UV rays can be used. As said sensitizer, alkylamines and ethyleneamines are used. The peeling promoting adjuvant, the polymn. initiator, and the sensitizer are used each in an amt. of 8-20, 1-20, and 1-2pts.wt. per 100pts.wt. of said monomer or oligomer, respectively.
申请公布号 JPS59171949(A) 申请公布日期 1984.09.28
申请号 JP19830045759 申请日期 1983.03.18
申请人 SONY KK 发明人 ISHII MASAMI;OOSAWA KENJI;IKEGAMI YUUJI;TOKUMITSU HAJIME;OOTA MASAYUKI
分类号 G03F7/004;C08F2/00;C08F2/50;C08F290/00;C08F299/00;G03F7/033 主分类号 G03F7/004
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