| 摘要 |
<p>PURPOSE:To obtain the titled substrate of high reliability by a method wherein a metallic foil having a required conduction path is adhered on the surface of a metallic substrate of good thermal conductivity by means of an insulation adhesive, and a noble metal becoming a bonding pad is fixed on this foil, which is then surrounded with solder resist. CONSTITUTION:The metallic substrate 1 is coated with the insulation adhesive 2, the metallic foil 6 made of Ni, etc. is adhered thereon, the part other than a bonding pad forming region is covered with a resist 7, and then a plurality of noble metallic layers 8 becoming bonding pads are provided therebetween. Next, the film 7 is removed, the surface of the exposed metallic foil 6 and the noble metallic layer 8 are covered with a resist film 9 by leaving only the etched part, and the said foil 6 exposed to the etched part is removed by etching. Thereafter, the unnecessitated film 9 is removed, and the periphery of the layer 8 on the remnant foil 6 is surrounded with the solder resist 10, thus being made as the titled substrate. The cost of the circuit substrate is reduced while enhancing the reliability and the workability in such a manner.</p> |
