| 摘要 |
The adhesive feed device has a heatable adhesive reservoir (7) which has a receiving chamber (8) for a predetermined volume of adhesive and is preceded by a heatable screw conveyor (2) receiving adhesive granules and an adjoining heatable adhesive duct (6) connected to the receiving chamber (8), and which is equipped with a pump (10) which pushes the adhesive out of the receiving chamber (8) via a feed duct (12,13,14) to the application apparatus (1), and also with a return duct (17,18) opening into the receiving chamber (8) for the unused adhesive coming from the application apparatus (1). An adhesive feed process is carried out with this feed device in which the adhesive granules are brought into a conveyor path and then preheated during transport, and the adhesive then flows through a heating path in which it is brought to its processing temperature and is liquefied, and then enters a heated adhesive reservoir, from which it is fed under pressure to the application apparatus and into which the adhesive not used in the application apparatus flows back. This feed device works with the application apparatus in the adhesive and heating medium circuits, and always brings only a given adhesive volume into the processing state, so that fresh adhesive is always ready for use. <IMAGE>
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