发明名称 |
Bonding semiconductive bodies. |
摘要 |
Reproduceability and reliability problems associated with using a solder preform to bond a semiconductor laser chip (1) to a heat sink (2) are avoided by a diffusion assisted bonding method. Both surfaces to be bonded are coated with relatively thick layers of gold (3,7), one of which is then coated with a submicron thickness tin layer (5) whose surface is protected from oxidation with a further coating (6) of gold. The two components are assembled and heated to bond them together by causing a molten gold-tin eutectic layer to be formed which then diffuses into the gold layers without penetrating right through them. |
申请公布号 |
EP0119691(A2) |
申请公布日期 |
1984.09.26 |
申请号 |
EP19840300434 |
申请日期 |
1984.01.25 |
申请人 |
STC PLC |
发明人 |
DEAN, RALPH BARTON;JANESSEN, ADRIAN PERRIN;STONE, JENNIFER KAREN;WALKER, ARTHUR |
分类号 |
B23K35/00;H01L21/60;H01L23/492;H01L33/62 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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