| 摘要 |
PURPOSE:To improve the reliability of a semiconductor device by providing moisture immersion preventing means near a pellet, thereby improving moisture resistance. CONSTITUTION:In a metal tab 2, on which a pellet 1 is mounted, a slender hole or notch (through hole) 12 is opened between a pellet mounting unit and both side tab leads 3. Moisture 8 transmitted through the leads 3 does not reach directly the pellet 1, but the quantity of water is dispersed as shown by arrows at the through hole part 12 of the tab 2, once turned to the outside, and then reach the pellet 1. Accordingly, the time until the moisture resistance is deteriorated takes long time, with the result that the reliability can be improved. |
