发明名称 STICKING PROCESS OF ADHERING FILM
摘要 PURPOSE:To stick an adhering tape onto the brittle thin plate with arbitrary shapes such as a silicon wafer by sticking a film, after separated, onto the surface of an article to be stuck, using a releasable band like strip to which an adhering film is stuck. CONSTITUTION:The stopper capable of rising and lowerong by an air cylinder or a magnet is provided at the front of a suction table 32, and the sheet of an article 16 is supplied on said suction table 32. At the condition where the notch of an article 16 touches the stopper, a belt 18 is stopped, and the article is fixed onto the suction table by vacuum suction. Then, a film 12 is separated from a band like strip 11 bent at a steep angle by drawing the band like strip 11, driving a winding shaft and pulling rollers 31. Then, the notch 13 of the film touches the stopper and is caused to be in contact with the upper part of the article 16-tip, and the article 16 and the film 12 are caused to adhere mutually and simultaneously moved, where by the film 12 is accurately stuck onto the article 16.
申请公布号 JPS59169811(A) 申请公布日期 1984.09.25
申请号 JP19830045352 申请日期 1983.03.16
申请人 NITTO DENKI KOGYO KK 发明人 FUNAKOSHI KEIGO;NOMURA KOUZOU;AMETANI MINORU;OONISHI KENJI
分类号 B29C65/00;B29C55/00;B29C65/48;B29C65/52;B29C65/78;B29L9/00;B65C1/02;B65C9/02;B65C9/18;C09J5/00;H01L21/304 主分类号 B29C65/00
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