| 摘要 |
PURPOSE:To prevent the creeping of a resist material onto the back of a disk to be coated by spraying a gas from the back. CONSTITUTION:A wafer such as a silicon wafer 2 is placed on a chuck 1, a resist material is dropped from a resist material dropping pipe 3 at the upper section of the wafer, the chuck 1 is turned while a gas is sprayed from a pipe 4, the wafer is treated for the time required, the chuck 1 is stopped, and the spraying of the gas is stopped. Accordingly, a creeping onto the back of the silicon wafer 2 of the resist material can be prevented. |
