| 摘要 |
1. Multi-layer with a foil, containing a proportion of at least 5% of elements having an affinity for oxygen, of active solder having a microcrystalline or amorphous structure, wherein the solder comprises a ductile, layer-type metal body with active solder foils applied to both sides, the metal body has the shape of a 0.3 to 1 mm thick band or sheet of copper, a copper alloy, a copper beryllium alloy, a copper/nickel alloy, tantalum, zirconium, niobium, molybdenum, aluminium or an aluminium alloy, and the foils applied to both sides of the metal body are fixed by means of spot-welding. |
