| 摘要 |
<p>PURPOSE:To form a highly heat resistant heat generating resistor having sufficient breakage life under a high speed driving condition of pulse amplitude of 0.5ms or less or a high resolving power condition of 12 dots/mm., by specifying the coefficient of thermal expansion, heat conductivity and thickness of a heat accumulating glaze glass layer. CONSTITUTION:The coefficient of thermal expansion of a heat accumulating glaze glass layer is set to 2X10<-6>/ deg.C (a room temp.-400 deg.C) or less, the heat conductivity thereof is set to 1X10<-3>-5X10<-3>cal/s.cm. deg.C (a room temp.-400 deg.C) and the thickness thereof is 30mum or more to form a heat resistor. In addition, an insulating film with coefficient of thermal expansion of 1X10<-6> (a room temp. -400 deg.C) or less, heat conductivity of 1X10<-3>-5X10<-3>cal/s.cm. deg.C (a room temp. -400 deg.C) and a thickness of 5mum or more is provided between the heat accumulating glaze glass layer and the heat resistant film layer to make it possible to prolong the life of said heat generating resistor layer. By making the coefficient of thermal expansion of the glaze glass layer approximate to the coefficient of thermal expansion 6.9X10<-6>/ deg.C of an alumina substrate, the formation of the glaze glass layer onto the alumina substrate can be facilitated.</p> |
