发明名称 |
WIRED SUBSTRATE FOR MOUNTING LARGE-SCALE INTEGRATED CIRCUITS USED IN DATA PROCESSING AND COMMUNICATION SYSTEMS |
摘要 |
A fine-wired conductor for use in LSI circuits exhibits good adhesion properties. The conductor is made up of a film of metal such as chrome or titanium on an insulator such as a ceramic substrate, a gold layer over the film of metal and a palladium film on the gold layer. In addition, a palladium layer can be interposed between the metal film and the gold layer to facilitate gold plating and inhibit diffusion of the metal and the gold. |
申请公布号 |
GB2136453(A) |
申请公布日期 |
1984.09.19 |
申请号 |
GB19840006376 |
申请日期 |
1984.03.12 |
申请人 |
* NEC CORPORATION |
发明人 |
TATSUO * INOUE;MITSURU * KIMURA |
分类号 |
H05K3/46;H01B5/14;H01L23/498;H05K3/38;(IPC1-7):01B5/14 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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