| 摘要 |
<p>PURPOSE:To prevent enlargement of the area for mounting IC chips as well as to protect the internal wiring by connecting the internal wiring of the monolithic IC chip and the input and output pins electrically through the metal in small holes opened on the resin film of polyimide group covering the internal wiring of the IC chips. CONSTITUTION:The plane for forming an internal wiring of a monolithic IC chip 10 is covered with the polyimide-group resin film 40 and small holes opened on the film 40 are filled with gold 41. The gold 41 connects the internal wiring of the IC chip 10 to a metallic pads 42 composed of a chromium thin film, a palladium thin film and a gold-gilding film formed on the film 40, electrically. The input and output pins 44 consisting of copper alloy surface of which is coated with gold-gilding are stuck to the metallic pads 42 by high-temperature solder 43. These pins are inserted into through-holes arranged on the high-density printing board 30 using the polyimide-group resin as an insulating material. Through-hole gilding 31 and the input and output pins 44 are stuck by low-temperature solder 32.</p> |
