| 摘要 |
PURPOSE:To obtain a light emitting element which is improved in the heat sink and has excellent characteristics and reliability by composing a metal layer formed on an electrode of the side to be mounted on the heat sink or a package of a metal to become a reaction barrier between a plated layer metal and a mounting solder agent. CONSTITUTION:A gold plating layer 29 is formed on a P type ohmic electrode 26, and a titanium-platinum metal 30 is formed by an electrode beam deposition or sputtering method on the surface of a gold plating layer 29. Eventually, metal 31 is formed on the surface of the platinum layer by a depositing or plating method. When a solder agent 14 of tin formed on the heat sink 13 is fused and an LED of this structure is fusion-bonded to the heat sink 13, a titanium-platinum layer 30 is formed on the surface of the layer 29. Accordingly, the solder agent 14 of tin and a reactive layer 15 of gold are suppressed in the progress by the layer 30, and is not proceeded to the layer 29. As a result, the thermal conductivity of the PHS does not decrease, and the stress is suppressed by the reaction layer. |
