| 摘要 |
PURPOSE:To make it possible to obtain eight dots/mm. as recording density, by arranging the IC chip for the drive circuit mounted to a thermal head so as to align the output pads of an output driver along one side of the IC chip. CONSTITUTION:The pads O1-O32 of the IC chip 1 for a drive circuit are the output pads connected to an output driver 17 and successively arranged from right to left along one side of the surface of the IC chip 1 while the ground pads 11-14, 115-118 and control signal pads 15-114 of the output driver 17 are arranged to the opposed side of said IC chip 1. These ground pads are connected to a wiring pattern 20 having large current capacity formed to the surface of the IC chip 1 by gold or solder. By this mechanism, the constitution of the ground terminals in the IC chip becomes simple and the output pads O1-O32 can be arranged at high density and a thermal head with 8 dots/mm. is obtained.
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