| 摘要 |
<p>PURPOSE:To enhance cooling faculty to an LSI package by a method wherein heat of LSIs is deprived of by evaporation heat of a low boiling point liquid coolant, and heat thereof is radiated. CONSTITUTION:LSI boards 7 holding LSI cards 5 are immersed in a low boiling point liquid coolant 8 in a vessel 9. Heat generated from LSIs 1 is conducted to heat sinks 3 through LSI substrates 2, and is deprived of by evaporation heat of the inactive low boiling point liquid coolant 8 such as flon, etc. from the surfaces of the heat sinks 3. Moreover, the gasified low boiling point liquid coolant 8 rises in top space of the vessel 9, cooled by coming in contact with the plane heat sinks 10 of a cooling module 11 being cooled to the boiling point or less of the coolant 8 according to cool water flowing always, and drops as a liquid.</p> |
