| 摘要 |
PURPOSE:To reduce a space obtained by etching by a method wherein, after a copper laminated board is etched, a hole is drilled at the part where two sides are connected and then, after a required copper thicknees is obtained by electrolytic plating, the connection part is connected by electrolitic plating. CONSTITUTION:A copper laminated board is composed of an insulation layer 1 and copper layers 2 and the copper thickness is less than required. A resist 5 is applied on the surface of the laminated board. Necessary pattern is printed by light. After development, the copper laminated board is etched by ferrous chloride solution. Then the resist is removed and a hole 3 is drilled at the connection part. Coating 4 is applied on two sides by electroforming plating to obtain the required thickness. |
