Method and device for the continuous removal of excess solder from metal strips

摘要

Method and device for the continuous removal of excess solder from hot-dip-galvanized metal parts, which can have breaks as well as prominences, by means of a slit-shaped capillary element which is formed, for example, by two metal plates which are wetted by the liquid material and are held at a slight distance from one another. The excess solder is drawn into the slit by capillary action and is directed back to the solder container. <IMAGE>