| 摘要 |
PURPOSE:To facilitate multi-connection by a method wherein bonding parts of stitch land parts of conductive patterns are arranged alternately in two rows. CONSTITUTION:The conductive patterns 2 of the laminated structure of Cu, Ni, Au, etc. are formed on a non-conductor substrate by plating, etching, etc., and the stitch land parts 3 of a part of the patterns 2 and a semiconductor element 4 mounted on the substrate are connected by means of bonding fine wires 5. Further, the element 4 and a part of the patterns 2 are sealed with resin. The bonding parts of the stitch lands 3 are so arranged alternately as to become in two rows with respect to a side of the element 4. Thereby, it becomes unnecessary to narrow the width of the stitch land 3. |
