| 摘要 |
PURPOSE:To enable the automation of assembly by mounting a light emitting element on an insulation substrate whereon an Au film is formed and then leading out electrodes from the upper surface of said element and the surface of the Au film by wire bonding. CONSTITUTION:A metallic thin film 11 and the Au thin film 12 are formed on the substrate 10, and unnecessary parts are removed by patterning. Next, a metallic film 13 is formed at the part for mounting a laser diode element 16, and further a solder 15 is formed by a lift-off method. Successively, the substrate 10 is devided into individual pellets, and said element 16 is placed on the solder 15 and then hardened by fusing the solder by heating. Then, the Au wires 17 and 18 are connected by wire bonding. Thus, the soldering of an Au pedestal is unnecessitated, and accordingly automatic assembly becomes simple. |
