发明名称 LEAD FRAME
摘要 PURPOSE:To improve workability and yield by separately forming a sprocket hole for feeding a tape and another one for mounting of two kinds in sprocket holes. CONSTITUTION:With a tape-carrier system lead-frame, sprocket holes 2 for feeding a tape and sprocket holes 6 for mounting are formed separately on both sides of a tape-shaped insulating film 1 made of polyimide, etc. Accordingly, defective positioning on mounting due to the damage of the sprocket holes can be removed completely, and the facility of work and yield can be improved.
申请公布号 JPS59158545(A) 申请公布日期 1984.09.08
申请号 JP19830032287 申请日期 1983.02.28
申请人 NIPPON DENKI KK 发明人 NAKAMORI SUSUMU
分类号 H01L21/60;H01L23/495 主分类号 H01L21/60
代理机构 代理人
主权项
地址
您可能感兴趣的专利