SEMICONDUCTOR DEVICE

摘要

A multiplicity of semiconductor chips constituting the active elements of a semiconductor power device are attached, in a predetermined configuration, to a metal plate which acts as both a support and a first electrical terminal. Two other electrical terminals are formed by two metal electrodes having an interdigitated structure with the fingers of one electrode being inserted between those of the other electrode and which are positioned above the semiconductor chips and have tabs for establishing a connection between the electrodes and the two contact areas of each chip.