| 摘要 |
PURPOSE:To obtain the plane locationing device with high accuracy suitable for automation by a method wherein at least three non-contact position detecting means above an object plane are provided for locationing plane of the object on the reference plane and plane of the object is made to be in accordance with the reference plane using an independent driving means according to output signals from said position detecting means. CONSTITUTION:A leaf-spring 40 is attached to a pair of plates 39 standing on the end of a base 38 and this leaf-spring supports a chuck 2 on which a semiconductor wafer 1 is placed. Next, position detecting devices 36a, 36b and 36c are arranged above the wafer 1 in uniform intervals with being non-contact state with the wafer 1. By this constitution, detected output of each of the detecting devices 36a, 36b and 36c are sent to a controller 42 through a detecting part 41 and mechanisms 37a, 37b and 37c are operated independently to push up or to lower three points of the chuck 2 so as to make the surface of the wafer 1 parallel to the reference plane G. |
