Poly(butylene terephthalate) based molding resins

摘要

There is provided an improved molding resin capable of being molded into an article exhibiting reduced tendency to corrode a copper surface when the molded resin and the copper surface are placed in spaced relationship in a common unventilated atmosphere at elevated temperatures, as measured by the Bell Telephone Laboratories Copper Corrosion Test at temperatures within the range of from 150 DEG to 175 DEG C., wherein the molding resin comprises the combination of (a) a poly(butylene terephthalate) based polymer and aromatic halogen groups in a flame retardant amount, and (b) an alkylhydroxyphenylalkanoyl-hydrazine in an amount that is within the range of from 0.05 to 0.6% by weight, based on the weight of the molding resin, and less than 0.8% by weight based on the polymer.