| 摘要 |
Clamp-like guides are arranged in the interior of a soldering bath container at a distance from each other and distributed across the width of the soldering bath container. Each guide has two guide rods which are spaced from each other by a certain distance and which are connected with each other at their lower ends. The upper final sections of the guide rods project upward from a soldering bath and have deflections at their upper ends which form a narrowing therebetween. The final sections can be elastically deflectable and are supported by support springs. Above the guides, two blast nozzles extend across the width of the soldering bath container and direct hot air jets against the surfaces of printed circuit boards leaving the soldering bath. The width of the narrowing is somewhat larger than the thickness of the printed circuit boards. Several guiding points are formed across the width of the printed circuit board by the guides without necessitating a constant mechanical contact between the printed circuit board and the guide rods. Since the upper final sections of the guide rods can elastically yield when the printed circuit board abuts against the deflections, damage to the printed circuit board is avoided.
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